ARIES Embedded has unveiled the MSRZG3E, an OSM-compliant System-in-Package (SiP) powered by the Renesas RZ/G3E microprocessor. Designed for industrial HMI, medical systems, and edge AI applications, this compact module combines high-performance computing with efficient real-time control, offering a robust solution for embedded and connected devices.
At its heart, the Renesas RZ/G3E SoC features:
- A quad-core Arm Cortex-A55 CPU for application processing
- A Cortex-M33 real-time core for deterministic control
- An Ethos-U55 NPU delivering up to 512 GOPS of AI performance
The SoC also includes PCIe Gen3, USB 3.2, dual Gigabit Ethernet, CAN FD, and multiple serial interfaces such as UART, I²C, SPI, and ADC — making it a complete solution for industrial edge systems.
MSRZG3E SiP Key Specifications
| Feature | Description |
|---|---|
| Processor (SoC) | Renesas RZ/G3E dual or quad Arm Cortex-A55 with Arm Cortex-M33 core |
| Neural Processing | Ethos-U55 NPU delivering up to 512 GOPS for AI acceleration |
| Memory | 512 MB to 8 GB LPDDR4 RAM |
| Storage | 4 GB to 64 GB eMMC flash, plus 2 Mbit–512 Mbit SPI NOR flash |
| Display Support | MIPI-DSI (up to 1920×1200 @ 60 fps), RGB (up to 1280×800 @ 60 fps) |
| Camera Interface | MIPI-CSI (1/2/4 lanes) |
| Networking | Dual Gigabit Ethernet ports (10/100/1000 Mbps) |
| USB | 1× USB 3.2 host, 2× USB 2.0 (Host/OTG) |
| Expansion Interfaces | PCIe Gen3 x2 (Root Complex or Endpoint), I²C, SPI, UART, 2× CAN, ADC |
| Package Type | 476-pad LGA, OSM Size M (45 × 30 mm) |
| Operating Temperature | 0°C to +70°C (commercial), -40°C to +85°C (industrial) |
The SiP integrates memory and storage in a compact form factor, supporting both commercial and industrial-grade temperature ranges.
The ARIES MSRZG3E SiP runs a Linux BSP based on the Yocto Project, offering complete support for:
- Graphics and multimedia
- Networking and industrial connectivity
- Secure, container-based software deployment
For real-time applications, the Cortex-M33 core can run FreeRTOS, Zephyr, or bare-metal tasks, allowing hybrid workloads that balance deterministic control and Linux-based AI processing.
Developers can use:
- Renesas e² studio
- GCC toolchains
- Yocto SDK
Comprehensive documentation and open-source resources are available via ARIES Embedded’s GitHub repository.
To accelerate development, ARIES also offers the MSRZG3EEVK — an evaluation kit featuring the MSRZG3E OSM module (R9A09G047E57GBG CPU). The kit simplifies prototyping and validation for embedded designs.
MSRZG3EEVK Key Specifications
| Feature | Description |
|---|---|
| Main Module | ARIES MSRZG3E SiP |
| Memory | 2 GB LPDDR4 RAM |
| Storage | 8 GB eMMC, 128 Mbit SPI NOR, MicroSD card slot |
| Display | FPC connector or pin header |
| Networking | Gigabit Ethernet RJ45 connector |
| USB | USB Host Type-A, USB OTG microAB, Console via USB microAB |
| Expansion I/O | UART, CAN, SPI, I²C, GPIO, JTAG via pin headers |
| Operating Temperature | -25°C to +70°C |
This evaluation kit follows the Open Standard Module (OSM) specification, supporting connector-less integration for compact and rugged embedded systems.
Thanks to its Ethos-U55 NPU, multi-core architecture, and wide I/O range, the MSRZG3E SiP is ideal for:
- Industrial human-machine interfaces (HMIs)
- Edge AI inference systems
- Medical imaging and diagnostics
- Smart automation and robotics
The combination of Linux and real-time cores enables developers to run AI, control logic, and communication tasks simultaneously — a major benefit for next-generation industrial systems.
The ARIES MSRZG3E SiP and the MSRZG3EEVK Evaluation Kit will be available starting Q3 2025. Pricing details have not yet been announced.
More information, datasheets, and documentation can be found on the ARIES Embedded product page and official press release.
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