Wafer.Space has officially launched its first pooled silicon fabrication run on Crowd Supply, called GF180MCU Run 1, giving designers, hobbyists, and companies an affordable way to create custom ASICs using GlobalFoundries’ 180nm mixed-signal process.
With this innovative platform, anyone can design and manufacture 1,000 custom chips—for as little as $7 per die—marking a new era of accessible custom silicon design.
Each slot on the wafer provides a 3.88 × 5.07 mm (19.67 mm²) die area, replicated 1,000 times. Participants will receive 1,000 chips, available either as bare dies or with chip-on-board (COB) packaging.
The GF180MCU process includes:
- 5 metal layers
- MIM capacitors (~2.0 fF/µm²)
- Poly and high-res poly resistors
- Standard-Vt MOS devices
Designers can manage their pad ring, ESD, and I/O layout, while Wafer.Space handles fabrication, dicing, and shipping from Singapore. Both open-source and closed-source designs are supported, and full wafers are available for testing or collection.
| Feature | Details |
|---|---|
| Fabrication Process | GlobalFoundries 180nm Mixed-Signal CMOS (GF180MCU) |
| Die Area | 3.88 × 5.07 mm (19.67 mm²) |
| Production Quantity | 1,000 Chips per Slot |
| Packaging Options | Bare Die or Chip-on-Board (COB) |
| Design Tools | LibreLane, Magic, KLayout, xschem, SPICE, Commercial EDA |
| Pricing | $7,000 (Bare Die), $8,500 (COB) |
| Design Submission | Via GDSII Files |
| Shipping | March 2026 (from Singapore) |
| Campaign Ends | November 28, 2025 |
Tools & Design Process
Design submissions are made using GDSII files, the standard format for chip layouts. Wafer.Space runs automatic design rule checks to ensure manufacturability.
You can design your chip using:
- Open-source tools: LibreLane, Magic, KLayout, xschem, SPICE
- Commercial EDA software
For convenience, Wafer.Space also offers optional chip packaging services, mounting and wire-bonding the dies onto boards using ready-made templates.
Partnerships & Advanced Options
Wafer.Space is collaborating with JLCPCB, PCBWay, and Seeed Studio to enable direct PCBA assembly and bonding in future runs. For advanced research, full undiced wafers are also available for MEMS, sensor, and nanofluidics applications.
Users can join Wafer.Space’s Discord community for help with pad-ring design, verification, and final design checks.
Each slot in GF180MCU Run 1 costs:
- $7,000 for 1,000 bare dies
- $8,500 for chip-on-board packaging
Fabrication is handled by GlobalFoundries in Singapore, with expected shipment in March 2026.
For full details, visit the official Wafer.Space GF180MCU Run 1 page on Crowd Supply or explore the E-Lab interview with Wafer.Space Founder for an inside look at their mission to democratize silicon design.
0 Comments